By UZIN
Low stress synthetic gypsum based self leveling and smoothing compound with high performance flow technology. Particularly suitable for the renovation of old and mixed substrates. The exceptional smooth surface allows for the installation of all types of floor covering. For interior use only.
UZINC110S-main

Description:

Low stress synthetic gypsum based self leveling and smoothing compound with high performance flow technology. Particularly suitable for the renovation of old and mixed substrates. The exceptional smooth surface allows for the installation of all types of floor covering. For interior use only.

  • Item #:

    83246

  • UOM:Each
  • Availability:Login for Availability

Data Sheet
SDS

Packaging:

50 lb per Each
42 Each per Pallet

Coverage:

30 sq. ft. at 1/4" depth per 50 lb. bag (approx.)
*actual coverage may vary depending on substrate conditions.

Applications:

- All types of floor covering
- Installation of engineered wood flooring with UZIN wood floor adhesives
- Gypsum substrates including gypsum fiberboard, plywood and OSB
- Old gypsum concrete or concrete subfloors with existing ceramic tile, stone and terrazzo
- Plywood and OSB with old non water soluble adhesive or leveling
compound residues
- Thin, well bonded cutback adhesive residue (see “Important Notes” in PDS)
- Residential and commercial use
- Radiant floor heating systems (hydronic or electric)

Properties:

- Virtually stress-free drying and curing properties - great for difficult substrates
- Fast setting - ready for installation on common floor coverings after approximately 16 hours
- Pumpable - minimizes time and effort
- Very smooth surface - increased adhesive coverage rate
- Meets strict EMICODE EC 1 PLUS criteria (healthy indoor air quality and very low emission)

Documentation:

No documents available.

Packaging:

50 lb per Each
42 Each per Pallet

Coverage:

30 sq. ft. at 1/4" depth per 50 lb. bag (approx.)
*actual coverage may vary depending on substrate conditions.

Applications:

- All types of floor covering
- Installation of engineered wood flooring with UZIN wood floor adhesives
- Gypsum substrates including gypsum fiberboard, plywood and OSB
- Old gypsum concrete or concrete subfloors with existing ceramic tile, stone and terrazzo
- Plywood and OSB with old non water soluble adhesive or leveling
compound residues
- Thin, well bonded cutback adhesive residue (see “Important Notes” in PDS)
- Residential and commercial use
- Radiant floor heating systems (hydronic or electric)

Properties:

- Virtually stress-free drying and curing properties - great for difficult substrates
- Fast setting - ready for installation on common floor coverings after approximately 16 hours
- Pumpable - minimizes time and effort
- Very smooth surface - increased adhesive coverage rate
- Meets strict EMICODE EC 1 PLUS criteria (healthy indoor air quality and very low emission)

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